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HEATSINK BGA W/ADHESIVE TAPE - 371824B00032 - Thermal Management

Digi-Key Part Number HS313-ND
Price Break
1
10
100
500
1000
5000
Unit Price
3.73000
3.35300
2.60750
2.23500
2.08600
1.89975
Extended Price
3.73
33.53
260.75
1117.50
2086.00
9498.75
Manufacturer Part Number371824B00032
DescriptionHEATSINK BGA W/ADHESIVE TAPE
Quantity Available 57
All prices are in USD

QuantityItem NumberCustomer Reference

When requested quantity exceeds displayed pricing table quantities, a lesser unit price may appear on your order.
You may submit a request for quotation on quantities which are greater than those displayed in the pricing table.

Click here to find RoHS Compliant Substitutes
Technical/Catalog Information371824B00032
VendorAavid Thermalloy
CategoryThermal Management
Attachment MethodThermal Tape, Adhesive (Included)
Height0.275" (7mm)
MaterialAluminum
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise1.5W @ 50°C
Series-
Thermal Resistance @ Forced Air Flow10.0°C/W @ 200 LFM
Outline35mm x 35mm
Lead Free StatusContains Lead
RoHS StatusRoHS Non-Compliant
Other Names 371824B00032
371824B00032
HS313 ND
HS313ND
HS313

371824B00032 Specification Sheet

Image of HEATSINK BGA W/ADHESIVE TAPE - 371824B00032

HEATSINK BGA W/ADHESIVE TAPE - 371824B00032 (HS313-ND) - Thermal Management

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