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HEAT SINK 30MM X 30MM X 17.5MM - ATS-50300P-C2-R0 - Thermal Management

Digi-Key Part Number ATS1039-ND
Price Break
1
10
100
500
1000
Unit Price
12.53000
9.63600
8.07650
7.51950
7.24100
Extended Price
12.53
96.36
807.65
3759.75
7241.00
Manufacturer Part NumberATS-50300P-C2-R0
DescriptionHEAT SINK 30MM X 30MM X 17.5MM
Quantity Available 90
All prices are in USD

QuantityItem NumberCustomer Reference

When requested quantity exceeds displayed pricing table quantities, a lesser unit price may appear on your order.
You may submit a request for quotation on quantities which are greater than those displayed in the pricing table.

Technical/Catalog InformationATS-50300P-C2-R0
VendorAdvanced Thermal Solutions Inc
CategoryThermal Management
Attachment MethodClip
Height0.69" (17.53mm)
MaterialAluminum
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Power Dissipation @ Temperature Rise-
Thermal Resistance @ Forced Air Flow3.4°C/W @ 200 LFM
Outline30.00mm x 30.00mm
Thermal Resistance @ Natural-
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names ATS 50300P C2 R0
ATS50300PC2R0
ATS1039 ND
ATS1039ND
ATS1039

ATS-50300P-C2-R0 Specification Sheet

Image of HEAT SINK 30MM X 30MM X 17.5MM - ATS-50300P-C2-R0

HEAT SINK 30MM X 30MM X 17.5MM - ATS-50300P-C2-R0 (ATS1039-ND) - Thermal Management

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HEAT SINK 30MM X 30MM X 17.5MM - ATS-50300P-C2-R0
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HEAT SINK 30MM X 30MM X 17.5MM - ATS-50300P-C2-R0