HEATSINK CPU W/ADHESIVE 1.31"SQ - BDN13-3CB/A01 - Thermal Management
| Digi-Key Part Number | 294-1100-ND |
1 10 100 |
3.30000 2.97000 2.31000 |
Extended Price
3.30 29.70 231.00 |
| Manufacturer Part Number | BDN13-3CB/A01 | |||
| Description | HEATSINK CPU W/ADHESIVE 1.31"SQ | |||
| Quantity Available | 1898 | |||
| All prices are in USD | ||||
When requested quantity exceeds displayed pricing table quantities, a lesser unit price may appear on your order.
You may submit a request for quotation on quantities which are greater than those displayed in the pricing table.
| Technical/Catalog Information | BDN13-3CB/A01 |
| Vendor | Cts Electronic Components (California) Inc |
| Category | Thermal Management |
| Attachment Method | Adhesive |
| Height | 0.35" (8.89) |
| Material | Aluminum |
| Package Cooled | CPU |
| Power Dissipation @ Temperature Rise | - |
| Series | - |
| Thermal Resistance @ Forced Air Flow | 6.0 °C/W @ 400 LFM |
| Outline L x W | 33.27mm x 33.27mm |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names |
BDN13 3CB A01 BDN133CBA01 294 1100 ND 2941100ND 294-1100 |
BDN13-3CB/A01 Specification Sheet
HEATSINK CPU W/ADHESIVE 1.31"SQ - BDN13-3CB/A01 (294-1100-ND) - Thermal Management
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